Qualcomm ≫ Snapdragon 8 Gen 3 Mobile Firmware

Memory corruption during the handshake between the Primary Virtual Machine and Trusted Virtual Machine.

Memory corruption when two threads try to map and unmap a single node simultaneously.

Transient DOS while parsing the received TID-to-link mapping element of beacon/probe response frame.

Transient DOS while processing an improperly formatted Fine Time Measurement (FTM) management frame.

Memory corruption as GPU registers beyond the last protected range can be accessed through LPAC submissions.

Memory corruption while playing audio file having large-sized input buffer.

Transient DOS while parsing a protected 802.11az Fine Time Measurement (FTM) frame.

Memory corruption in HLOS while checking for the storage type.

Memory corruption while verifying the serialized header when the key pairs are generated.

Memory corruption when the payload received from firmware is not as per the expected protocol size.