Qualcomm ≫ Sd 8cx Gen3 Firmware

59 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2022-40531

Memory corruption in WLAN due to incorrect type cast while sending WMI_SCAN_SCH_PRIO_TBL_CMDID message.

7.8

Memory corruption in WLAN due to integer overflow to buffer overflow in WLAN during initialization phase.

7.8

Memory corruption due to buffer copy without checking the size of input in HLOS when input message size is larger than the buffer capacity.

7.8

Memory corruption due to improper authentication in Qualcomm IPC while loading unsigned lib in audio PD.

Memory corruption in Core due to time-of-check time-of-use race condition during dump collection in trust zone.

9.8

Memory corruption due to buffer copy without checking the size of input in WLAN Firmware while processing CCKM IE in reassoc response frame.

7.5

Transient DOS in WLAN Firmware due to buffer over-read while processing probe response or beacon.

7.5

Transient DOS due to buffer over-read in WLAN while processing an incoming management frame with incorrectly filled IEs.

7.8

Memory corruption in modem due to buffer copy without checking size of input while receiving WMI command.

7.5

Information disclosure due to buffer over-read in WLAN while parsing NMF frame.