Qualcomm ≫ Sd 8cx Gen3 Firmware

59 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2023-21664

Memory Corruption in Core Platform while printing the response buffer in log.

7.8

Memory corruption in Core Platform while printing the response buffer in log.

7.1

Cryptographic issue in HLOS as derived keys used to encrypt/decrypt information is present on stack after use.

7.8

Memory Corruption in Core due to incorrect type conversion or cast in secure_io_read/write function in TEE.

7.1

Cryptographic issue in HLOS due to improper authentication while performing key velocity checks using more than one key.

9.8

Memory corruption due to buffer copy without checking size of input in Audio while voice call with EVS vocoder.

7.8

Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target.

8.8

Memory corruption due to buffer copy without checking the size of input in Core while sending SCM command to get write protection information.

7.8

Memory corruption due to integer overflow or wraparound in Core while DDR memory assignment.

7.8

Memory corruption due to double free in core while initializing the encryption key.