Qualcomm ≫ Qsm8250 Firmware

216 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

6.5

CVE-2023-28586

Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE.

7.8

Memory Corruption in camera while installing a fd for a particular DMA buffer.

7.8

Memory Corruption in SPS Application while exporting public key in sorter TA.

7.8

Memory corruption in Audio while processing the VOC packet data from ADSP.

5.5

Information Disclosure in Qualcomm IPC while reading values from shared memory in VM.

7.8

Cryptographic issue in HLOS during key management.

7.8

Memory Corruption in Core due to secure memory access by user while loading modem image.

7.8

Memory corruption in TZ Secure OS while loading an app ELF.

7.5

Transient DOS in WLAN Firmware while parsing rsn ies.

7.8

Memory corruption in WLAN HAL while handling command through WMI interfaces.