Qualcomm ≫ Qsm8250 Firmware

211 vulnerabilities found.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.5

CVE-2023-33089

Transient DOS when processing a NULL buffer while parsing WLAN vdev.

7.8

Warning

Memory corruption in DSP Services during a remote call from HLOS to DSP.

7.8

Memory corruption in Boot while running a ListVars test in UEFI Menu during boot.

7.8

Memory corruption in HLOS while invoking IOCTL calls from user-space.

8.8

Memory corruption while loading an ELF segment in TEE Kernel.

6.5

Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE.

7.8

Memory Corruption in camera while installing a fd for a particular DMA buffer.

7.8

Memory Corruption in SPS Application while exporting public key in sorter TA.

7.8

Memory corruption in Audio while processing the VOC packet data from ADSP.

5.5

Information Disclosure in Qualcomm IPC while reading values from shared memory in VM.