Qualcomm ≫ Qcn7606 Firmware

166 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.5

CVE-2023-33062

Transient DOS in WLAN Firmware while parsing a BTM request.

7.8

Memory corruption in HLOS while running playready use-case.

7.5

Transient DOS while parsing WPA IES, when it is passed with length more than expected size.

7.8

Memory corruption when processing cmd parameters while parsing vdev.

7.5

Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame.

7.5

Transient DOS in Bluetooth Host while rfc slot allocation.

7.8

Memory corruption in Boot while running a ListVars test in UEFI Menu during boot.

7.8

Memory corruption in HLOS while invoking IOCTL calls from user-space.

8.8

Memory corruption while loading an ELF segment in TEE Kernel.

6.5

Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE.