Qualcomm

Snapdragon 8 Gen 2 Mobile Firmware

73 vulnerabilities found.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.
  • EPSS 0.05%
  • Published 02.09.2024 12:15:19
  • Last modified 11.08.2025 15:06:17

Memory corruption while processing IOCTL call for getting group info.

  • EPSS 0.02%
  • Published 02.09.2024 12:15:18
  • Last modified 11.08.2025 15:06:17

Memory corruption when two threads try to map and unmap a single node simultaneously.

  • EPSS 0.26%
  • Published 02.09.2024 12:15:18
  • Last modified 11.08.2025 15:06:17

Transient DOS while parsing the multi-link element Control field when common information length check is missing before updating the location.

  • EPSS 0.08%
  • Published 02.09.2024 12:15:18
  • Last modified 11.08.2025 15:06:17

Memory corruption during the handshake between the Primary Virtual Machine and Trusted Virtual Machine.

  • EPSS 0.04%
  • Published 02.09.2024 12:15:18
  • Last modified 11.08.2025 15:06:17

Memory corruption when user provides data for FM HCI command control operations.

  • EPSS 0.26%
  • Published 02.09.2024 12:15:17
  • Last modified 11.08.2025 15:06:17

Transient DOS while parsing the received TID-to-link mapping element of beacon/probe response frame.

  • EPSS 0.23%
  • Published 03.06.2024 10:15:12
  • Last modified 09.01.2025 21:22:19

Transient DOS while processing an improperly formatted Fine Time Measurement (FTM) management frame.

  • EPSS 0.09%
  • Published 03.06.2024 10:15:11
  • Last modified 11.08.2025 15:06:17

Information disclosure in Video while parsing mp2 clip with invalid section length.

  • EPSS 0.1%
  • Published 03.06.2024 10:15:11
  • Last modified 11.08.2025 15:06:17

Cryptographic issue while performing attach with a LTE network, a rogue base station can skip the authentication phase and immediately send the Security Mode Command.

  • EPSS 0.04%
  • Published 03.06.2024 10:15:10
  • Last modified 11.08.2025 15:06:17

Memory corruption while copying a keyblob`s material when the key material`s size is not accurately checked.