Qualcomm

Snapdragon 8 Gen 2 Mobile Firmware

73 vulnerabilities found.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.
  • EPSS 0.05%
  • Published 08.07.2025 12:48:49
  • Last modified 11.08.2025 15:06:17

Information disclosure while decoding this RTP packet Payload when UE receives the RTP packet from the network.

  • EPSS 0.01%
  • Published 08.07.2025 12:48:46
  • Last modified 11.08.2025 15:06:17

Cryptographic issue while processing crypto API calls, missing checks may lead to corrupted key usage or IV reuses.

  • EPSS 0.02%
  • Published 08.07.2025 12:48:44
  • Last modified 11.08.2025 15:06:17

Memory corruption while operating the mailbox in Automotive.

  • EPSS 0.01%
  • Published 06.05.2025 08:32:32
  • Last modified 11.08.2025 15:06:17

Memory corruption while reading response from FW, when buffer size is changed by FW while driver is using this size to write null character at the end of buffer.

  • EPSS 0.06%
  • Published 06.05.2025 08:32:27
  • Last modified 11.08.2025 15:06:17

Transient DOS while parsing per STA profile in ML IE.

  • EPSS 0.01%
  • Published 06.05.2025 08:32:26
  • Last modified 11.08.2025 15:06:17

Memory corruption while processing a data structure, when an iterator is accessed after it has been removed, potential failures occur.

  • EPSS 0.03%
  • Published 03.03.2025 11:15:13
  • Last modified 11.08.2025 15:06:17

Memory corruption may occur while accessing a variable during extended back to back tests.

  • EPSS 0.09%
  • Published 03.02.2025 17:15:20
  • Last modified 11.08.2025 15:06:17

Memory corruption during management frame processing due to mismatch in T2LM info element.

  • EPSS 0.03%
  • Published 03.02.2025 17:15:20
  • Last modified 05.02.2025 16:01:01

Memory corruption can occur in the camera when an invalid CID is used.

  • EPSS 0.03%
  • Published 03.02.2025 17:15:20
  • Last modified 05.02.2025 16:02:02

Memory corruption while power-up or power-down sequence of the camera sensor.