Qualcomm ≫ Snapdragon X75 5g Modem-rf System Firmware

161 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2023-28550

Memory corruption in MPP performance while accessing DSM watermark using external memory address.

7.5

Transient DOS in WLAN Firmware while parsing t2lm buffers.

7.8

Memory Corruption in Audio while invoking callback function in driver from ADSP.

7.5

Transient DOS in WLAN Firmware when firmware receives beacon including T2LM IE.

7.8

Memory corruption in Audio while processing the VOC packet data from ADSP.

7.5

Transient DOS in WLAN Firmware while parsing WLAN beacon or probe-response frame.

7.8

Memory corruption while processing audio effects.

7.8

Memory corruption in core services when Diag handler receives a command to configure event listeners.

7.8

Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer.

9.8

Memory corruption in WLAN Firmware while parsing a NAN management frame carrying a S3 attribute.