Qualcomm ≫ Snapdragon X75 5g Modem-rf System Firmware

186 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2024-21465

Memory corruption while processing key blob passed by the user.

9.1

Information Disclosure while parsing beacon frame in STA.

7.5

INformation disclosure while handling Multi-link IE in beacon frame.

7.5

Information disclosure while handling SA query action frame.

7.8

Memory corruption in Core Services while executing the command for removing a single event listener.

7.5

Transient DOS while parse fils IE with length equal to 1.

7.5

Transient DOS while key unwrapping process, when the given encrypted key is empty or NULL.

7.5

Transient DOS while processing 11AZ RTT management action frame received through OTA.

7.5

Transient DOS in WLAN Firmware when the length of received beacon is less than length of ieee802.11 beacon frame.

9.8

Memory corruption while validating the TID to Link Mapping action request frame, when a station connects to an access point.