Qualcomm ≫ Snapdragon 665 Mobile Platform Firmware

55 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2023-33107

Warnung

Memory corruption in Graphics Linux while assigning shared virtual memory region during IOCTL call.

7.8

Memory corruption when processing cmd parameters while parsing vdev.

7.5

Transient DOS in Bluetooth Host while rfc slot allocation.

6.5

Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE.

8.8

Memory corruption while loading an ELF segment in TEE Kernel.

7.8

Memory corruption in UTILS when modem processes memory specific Diag commands having arbitrary address values as input arguments.

7.8

Memory corruption in MPP performance while accessing DSM watermark using external memory address.

7.8

Memory Corruption in SPS Application while exporting public key in sorter TA.

5.5

Information disclosure in WLAN HAL while handling command through WMI interfaces.

5.5

Information disclosure in IOE Firmware while handling WMI command.