Qualcomm

Snapdragon 662 Mobile Platform Firmware

119 vulnerabilities found.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.
  • EPSS 0.11%
  • Published 01.07.2024 15:15:16
  • Last modified 21.11.2024 08:57:39

Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released.

  • EPSS 0.17%
  • Published 01.07.2024 15:15:16
  • Last modified 21.11.2024 08:57:40

Memory corruption while handling user packets during VBO bind operation.

  • EPSS 0.09%
  • Published 01.07.2024 15:15:15
  • Last modified 21.11.2024 08:54:28

Memory corruption when an invoke call and a TEE call are bound for the same trusted application.

  • EPSS 0.08%
  • Published 01.07.2024 15:15:15
  • Last modified 21.11.2024 08:57:37

Memory corruption when allocating and accessing an entry in an SMEM partition.

  • EPSS 0.1%
  • Published 01.07.2024 15:15:14
  • Last modified 21.11.2024 08:54:25

Memory corruption while performing finish HMAC operation when context is freed by keymaster.

  • EPSS 0.08%
  • Published 01.07.2024 15:15:14
  • Last modified 21.11.2024 08:54:26

Transient DOS while loading the TA ELF file.

  • EPSS 0.1%
  • Published 01.07.2024 15:15:14
  • Last modified 21.11.2024 08:54:27

Memory corruption while processing key blob passed by the user.

  • EPSS 0.12%
  • Published 06.02.2024 06:16:03
  • Last modified 11.08.2025 15:06:17

Transient DOS while parse fils IE with length equal to 1.

  • EPSS 0.15%
  • Published 06.02.2024 06:16:02
  • Last modified 11.08.2025 15:06:17

Transient DOS while key unwrapping process, when the given encrypted key is empty or NULL.

  • EPSS 0.12%
  • Published 06.02.2024 06:16:02
  • Last modified 11.08.2025 15:06:17

Transient DOS in WLAN Firmware when the length of received beacon is less than length of ieee802.11 beacon frame.