Qualcomm ≫ Snapdragon 662 Mobile Platform Firmware

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7.8

CVE-2023-33063

Warnung

Memory corruption in DSP Services during a remote call from HLOS to DSP.

7.8

Memory corruption in Audio while running invalid audio recording from ADSP.

7.5

Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame.

7.5

Transient DOS in Bluetooth Host while rfc slot allocation.

7.8

Memory corruption in Boot while running a ListVars test in UEFI Menu during boot.

7.8

Memory corruption while using the UIM diag command to get the operators name.

7.8

Memory corruption in HLOS while invoking IOCTL calls from user-space.

7.8

Memory corruption in UTILS when modem processes memory specific Diag commands having arbitrary address values as input arguments.

8.8

Memory corruption while loading an ELF segment in TEE Kernel.

6.5

Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE.