Qualcomm ≫ Snapdragon 820 Automotive Platform Firmware

54 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

6.5

CVE-2023-28586

Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE.

7.8

Memory corruption in UTILS when modem processes memory specific Diag commands having arbitrary address values as input arguments.

7.8

Memory corruption in MPP performance while accessing DSM watermark using external memory address.

7.8

Memory Corruption in SPS Application while exporting public key in sorter TA.

8.8

Memory corruption in WLAN HOST while processing the WLAN scan descriptor list.

7.8

Memory corruption while processing audio effects.

5.5

Information disclosure in IOE Firmware while handling WMI command.

9.8

Memory Corruption in Multi-mode Call Processor while processing bit mask API.

7.5

Information Disclosure in data Modem while parsing an FMTP line in an SDP message.

7.5

Information Disclosure in Data Modem while performing a VoLTE call with an undefined RTCP FB line value.