Qualcomm ≫ Snapdragon X70 Modem-rf System Firmware

70 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

9.8

CVE-2023-33025

Memory corruption in Data Modem when a non-standard SDP body, during a VOLTE call.

6.8

Information disclosure in Core services while processing a Diag command.

7.5

Transient DOS in Modem when a Beam switch request is made with a non-configured BWP.

7.5

Transient DOS in Data modem while handling TLB control messages from the Network.

7.5

Transient DOS in Modem after RRC Setup message is received.

7.8

Memory corruption while using the UIM diag command to get the operators name.

6.5

Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE.

8.8

Memory corruption while loading an ELF segment in TEE Kernel.

7.8

Memory corruption in UTILS when modem processes memory specific Diag commands having arbitrary address values as input arguments.

7.8

Memory corruption in MPP performance while accessing DSM watermark using external memory address.