7.8

CVE-2016-2063

Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
Daten sind bereitgestellt durch National Vulnerability Database (NVD)
Linux ≫ Linux Kernel Version >= 3.0 <= 3.19.8
Zu dieser CVE wurde keine Warnung gefunden.
EPSS Metriken
Typ Quelle Score Percentile
EPSS FIRST.org 0.46% 0.362
CVSS Metriken
Quelle Base Score Exploit Score Impact Score Vector String
NIST 7.8 1.8 5.9
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
NIST 4.6 3.9 6.4
AV:L/AC:L/Au:N/C:P/I:P/A:P
CWE-119 Improper Restriction of Operations within the Bounds of a Memory Buffer

The product performs operations on a memory buffer, but it reads from or writes to a memory location outside the buffer's intended boundary. This may result in read or write operations on unexpected memory locations that could be linked to other variables, data structures, or internal program data.

http://www.securityfocus.com/bid/92381
Third Party Advisory
VDB Entry
https://us.codeaurora.org/cgit/quic/la/kernel/msm-3.10/commit/?id=ab3f46119ca10de87a11fe966b0723c48f27acd4
Patch
Third Party Advisory
Mailing List
https://www.codeaurora.org/stack-overflow-msm-thermal-driver-allows-kernel-memory-corruption-cve-2016-2063
Broken Link