Qualcomm ≫ Qcc710 Firmware

247 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

8.8

CVE-2023-28585

Memory corruption while loading an ELF segment in TEE Kernel.

6.5

Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE.

7.8

Memory corruption in BT controller while parsing debug commands with specific sub-opcodes at HCI interface level.

7.8

Memory Corruption in Audio while invoking IOCTLs calls from the user-space.

7.8

Memory Corruption in SPS Application while exporting public key in sorter TA.

7.8

Memory corruption in MPP performance while accessing DSM watermark using external memory address.

7.5

Transient DOS in WLAN Firmware while parsing t2lm buffers.

7.8

Memory Corruption in Audio while invoking callback function in driver from ADSP.

7.5

Transient DOS in WLAN Firmware when firmware receives beacon including T2LM IE.

7.8

Memory corruption in Audio while processing the VOC packet data from ADSP.