Qualcomm ≫ Sd 8 Gen1 5g Firmware

410 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

5.5

CVE-2022-33273

Information disclosure due to buffer over-read in Trusted Execution Environment while QRKS report generation.

7.8

Memory corruption in Automotive due to Improper Restriction of Operations within the Bounds of a Memory Buffer while exporting a shared key.

7.8

Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target.

8.8

Memory corruption due to buffer copy without checking the size of input in Core while sending SCM command to get write protection information.

7.8

Memory corruption due to integer overflow or wraparound in Core while DDR memory assignment.

7.8

Memory corruption due to stack based buffer overflow in core while sending command from USB of large size.

7.5

Transient DOS in modem due to reachable assertion.

7.8

Memory corruption due to buffer copy without checking the size of input in HLOS when input message size is larger than the buffer capacity.

7.5

Transient DOS due to buffer over-read in WLAN Firmware while parsing secure FTMR frame with size lesser than 39 Bytes.

9.8

Memory corruption in Video due to double free while playing 3gp clip with invalid metadata atoms.