Qualcomm ≫ Sd 8 Gen1 5g Firmware

391 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.5

CVE-2023-33080

Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame.

7.5

Transient DOS in Bluetooth Host while rfc slot allocation.

7.8

Memory corruption in Boot while running a ListVars test in UEFI Menu during boot.

8.8

Memory corruption while loading an ELF segment in TEE Kernel.

6.5

Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE.

7.8

Memory corruption in BT controller while parsing debug commands with specific sub-opcodes at HCI interface level.

7.8

Memory Corruption in SPS Application while exporting public key in sorter TA.

7.8

Memory corruption in MPP performance while accessing DSM watermark using external memory address.

9.8

Memory corruption in WLAN Firmware while parsing a NAN management frame carrying a S3 attribute.

7.5

Transient DOS in WLAN Firmware while parsing no-inherit IES.