Qualcomm ≫ Sd 8cx Gen2 Firmware

83 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2023-28538

Memory corruption in WIN Product while invoking WinAcpi update driver in the UEFI region.

7.8

Memory Corruption in Core Platform while printing the response buffer in log.

7.8

Memory corruption in Core Platform while printing the response buffer in log.

7.8

Memory Corruption in Core due to incorrect type conversion or cast in secure_io_read/write function in TEE.

7.1

Cryptographic issue in HLOS due to improper authentication while performing key velocity checks using more than one key.

9.8

Memory corruption due to buffer copy without checking size of input in Audio while voice call with EVS vocoder.

7.8

Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target.

7.8

Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length.

6.8

Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card.

8.8

Memory corruption due to buffer copy without checking the size of input in Core while sending SCM command to get write protection information.