Qualcomm ≫ Sm7325p Firmware

Information disclosure when VI calibration state set by ADSP is greater than MAX_FBSP_STATE in the response payload to AFE calibration command.

Memory corruption while processing buffer initialization, when trusted report for certain report types are generated.

Memory corruption in SPS Application while requesting for public key in sorter TA.

Memory corruption while processing finish_sign command to pass a rsp buffer.

Memory corruption while parsing qcp clip with invalid chunk data size.

Memory corruption while processing a QMI request for allocating memory from a DHMS supported subsystem.

Transient DOS while processing PDU Release command with a parameter PDU ID out of range.

Transient DOS while processing multiple IKEV2 Informational Request to device from IPSEC server with different identifiers.

Transient DOS while processing multiple payload container type with incorrect container length received in DL NAS transport OTA in NR.

Transient DOS while processing DL NAS Transport message, as specified in 3GPP 24.501 v16.