Qualcomm

Sm7325p Firmware

397 vulnerabilities found.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.
7.5

CVE-2023-33109

  • EPSS 0.17%
  • Published 02.01.2024 06:15:11
  • Last modified 11.08.2025 15:06:17

Transient DOS while processing a WMI P2P listen start command (0xD00A) sent from host.

7.5

CVE-2023-33112

  • EPSS 0.23%
  • Published 02.01.2024 06:15:11
  • Last modified 11.08.2025 15:06:17

Transient DOS when WLAN firmware receives "reassoc response" frame including RIC_DATA element.

7.8

CVE-2023-33038

  • EPSS 0.04%
  • Published 02.01.2024 06:15:10
  • Last modified 21.11.2024 08:04:32

Memory corruption while receiving a message in Bus Socket Transport Server.

7.5

CVE-2023-33040

  • EPSS 0.15%
  • Published 02.01.2024 06:15:10
  • Last modified 21.11.2024 08:04:33

Transient DOS in Data Modem during DTLS handshake.

7.5

CVE-2023-33062

  • EPSS 0.19%
  • Published 02.01.2024 06:15:10
  • Last modified 11.08.2025 15:06:17

Transient DOS in WLAN Firmware while parsing a BTM request.

7.8

CVE-2023-33085

  • EPSS 0.06%
  • Published 02.01.2024 06:15:10
  • Last modified 11.08.2025 15:06:17

Memory corruption in wearables while processing data from AON.

7.8

CVE-2023-33030

  • EPSS 0.06%
  • Published 02.01.2024 06:15:09
  • Last modified 21.11.2024 08:04:30

Memory corruption in HLOS while running playready use-case.

7.8

CVE-2023-33033

  • EPSS 0.06%
  • Published 02.01.2024 06:15:09
  • Last modified 21.11.2024 08:04:31

Memory corruption in Audio during playback with speaker protection.

7.8

CVE-2023-33092

  • EPSS 0.06%
  • Published 05.12.2023 03:15:14
  • Last modified 11.08.2025 15:06:17

Memory corruption while processing pin reply in Bluetooth, when pin code received from APP layer is greater than expected size.

7.5

CVE-2023-33098

  • EPSS 0.19%
  • Published 05.12.2023 03:15:14
  • Last modified 11.08.2025 15:06:17

Transient DOS while parsing WPA IES, when it is passed with length more than expected size.