Qualcomm ≫ Wcn3999 Firmware

286 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2023-33033

Memory corruption in Audio during playback with speaker protection.

7.5

Transient DOS while parsing WPA IES, when it is passed with length more than expected size.

7.8

Memory corruption when processing cmd parameters while parsing vdev.

7.5

Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame.

7.8

Memory corruption in Boot while running a ListVars test in UEFI Menu during boot.

8.8

Memory corruption while loading an ELF segment in TEE Kernel.

6.5

Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE.

7.8

Memory Corruption in SPS Application while exporting public key in sorter TA.

7.8

Memory corruption in MPP performance while accessing DSM watermark using external memory address.

7.8

Cryptographic issue in HLOS during key management.