Qualcomm ≫ Wcn3660b Firmware

533 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2023-21634

Memory Corruption in Radio Interface Layer while sending an SMS or writing an SMS to SIM.

7.8

Memory Corruption in camera while installing a fd for a particular DMA buffer.

7.8

Memory Corruption in SPS Application while exporting public key in sorter TA.

7.8

Memory corruption in MPP performance while accessing DSM watermark using external memory address.

7.8

Memory Corruption in Audio while invoking callback function in driver from ADSP.

7.8

Memory corruption in Audio while processing the VOC packet data from ADSP.

7.8

Memory corruption while processing audio effects.

7.8

Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer.

5.5

Information Disclosure in Qualcomm IPC while reading values from shared memory in VM.

9.8

Memory Corruption in Multi-mode Call Processor while processing bit mask API.