Qualcomm ≫ Wcd9370 Firmware

946 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.5

CVE-2025-27066

Transient DOS while processing an ANQP message.

7.5

Transient DOS while processing a frame with malformed shared-key descriptor.

7.8

Memory corruption while handling client exceptions, allowing unauthorized channel access.

7.5

Transient DOS while processing CCCH data when NW sends data with invalid length.

7.8

Memory corruption while processing commands from A2dp sink command queue.

6.5

Information disclosure while processing the hash segment in an MBN file.

6.5

Information disclosure while reading data from an image using specified offset and size parameters.

7.8

Memory corruption when programming registers through virtual CDM.

7.8

Memory corruption while processing IOCTL command when multiple threads are called to map/unmap buffer concurrently.

7.5

Transient DOS while processing a random-access response (RAR) with an invalid PDU length on LTE network.