Qualcomm

Sd 632 Firmware

114 vulnerabilities found.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.
7.8

CVE-2017-18330

  • EPSS 0.02%
  • Published 03.01.2019 15:29:01
  • Last modified 21.11.2024 03:19:52

Buffer overflow in AES-CCM and AES-GCM encryption via initialization vector in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212...

5.5

CVE-2017-11004

  • EPSS 0.05%
  • Published 03.01.2019 15:29:00
  • Last modified 21.11.2024 03:06:56

A non-secure user may be able to access certain registers in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, S...

7.8

CVE-2017-18141

  • EPSS 0.04%
  • Published 03.01.2019 15:29:00
  • Last modified 21.11.2024 03:19:26

When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Sn...

7.8

CVE-2017-18320

  • EPSS 0.04%
  • Published 03.01.2019 15:29:00
  • Last modified 21.11.2024 03:19:51

QSEE unload attempt on a 3rd party TEE without previously loading results in a data abort in snapdragon automobile and snapdragon mobile in versions MSM8996AU, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 6...