Qualcomm ≫ Sd 675 Firmware

541 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2025-27042

Memory corruption while processing video packets received from video firmware.

7.5

Transient DOS while processing received beacon frame.

7.5

Transient DOS may occur while processing malformed length field in SSID IEs.

7.8

Cryptographic issue while processing crypto API calls, missing checks may lead to corrupted key usage or IV reuses.

7.8

Memory corruption while operating the mailbox in Automotive.

8.2

Information disclosure when an invalid RTCP packet is received during a VoLTE/VoWiFi IMS call.

8.2

Information disclosure may occur while decoding the RTP packet with invalid header extension from network.

7.8

Memory corruption may occur while attaching VM when the HLOS retains access to VM.

7.8

Memory corruption during memory mapping into protected VM address space due to incorrect API restrictions.

7.8

Memory corruption during memory assignment to headless peripheral VM due to incorrect error code handling.