Qualcomm

Snapdragon X75 5g Firmware

8 vulnerabilities found.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.
7.8

CVE-2025-21424

  • EPSS 0.02%
  • Published 03.03.2025 11:15:15
  • Last modified 11.08.2025 15:06:17

Memory corruption while calling the NPU driver APIs concurrently.

7.5

CVE-2024-53027

  • EPSS 0.1%
  • Published 03.03.2025 11:15:14
  • Last modified 11.08.2025 15:06:17

Transient DOS may occur while processing the country IE.

7.8

CVE-2024-53014

  • EPSS 0.03%
  • Published 03.03.2025 11:15:13
  • Last modified 11.08.2025 15:06:17

Memory corruption may occur while validating ports and channels in Audio driver.

7.8

CVE-2024-53023

  • EPSS 0.03%
  • Published 03.03.2025 11:15:13
  • Last modified 11.08.2025 15:06:17

Memory corruption may occur while accessing a variable during extended back to back tests.

7.8

CVE-2024-43060

  • EPSS 0.03%
  • Published 03.03.2025 11:15:12
  • Last modified 06.03.2025 16:36:34

Memory corruption during voice activation, when sound model parameters are loaded from HLOS to ADSP.

5.5

CVE-2024-43051

  • EPSS 0.02%
  • Published 03.03.2025 11:15:11
  • Last modified 11.08.2025 15:06:17

Information disclosure while deriving keys for a session for any Widevine use case.

6.5

CVE-2024-43056

  • EPSS 0.02%
  • Published 03.03.2025 11:15:11
  • Last modified 11.08.2025 15:06:17

Transient DOS during hypervisor virtual I/O operation in a virtual machine.

7.8

CVE-2024-43057

  • EPSS 0.03%
  • Published 03.03.2025 11:15:11
  • Last modified 11.08.2025 15:06:17

Memory corruption while processing command in Glink linux.