Qualcomm ≫ Sm6650 Firmware

95 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2025-21481

Memory corruption while performing private key encryption in trusted application.

7.8

Memory corruption when passing parameters to the Trusted Virtual Machine during the handshake.

7.5

Transient DOS while creating NDP instance.

7.5

Transient DOS while processing an ANQP message.

7.5

Transient DOS while processing a frame with malformed shared-key descriptor.

7.8

Memory corruption while handling client exceptions, allowing unauthorized channel access.

6.5

Information disclosure while processing the hash segment in an MBN file.

6.5

Information disclosure while reading data from an image using specified offset and size parameters.

7.8

Memory corruption when programming registers through virtual CDM.

7.5

Transient DOS while processing a random-access response (RAR) with an invalid PDU length on LTE network.