Qualcomm ≫ Snapdragon 685 4g Mobile Platform (sm6225-ad) Firmware

11 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2024-38424

Memory corruption during GNSS HAL process initialization.

7.8

Memory corruption while processing user packets to generate page faults.

6.1

Information disclosure while sending implicit broadcast containing APP launch information.

7.5

Transient DOS while parsing the multiple MBSSID IEs from the beacon, when the tag length is non-zero value but with end of beacon.

8.4

Memory corruption when the mapped pages in VBO are still mapped after reclaiming by shrinker.

7.5

Transient DOS while parsing fragments of MBSSID IE from beacon frame.

7.5

Transient DOS while parsing the MBSSID IE from the beacons, when the MBSSID IE length is zero.

7.8

Memory corruption while processing graphics kernel driver request to create DMA fence.

7.5

Transient DOS while decoding attach reject message received by UE, when IEI is set to ESM_IEI.

7.8

Memory corruption when keymaster operation imports a shared key.