Qualcomm ≫ Sxr2250p Firmware

Memory corruption while handling user packets during VBO bind operation.

Memory corruption when an invoke call and a TEE call are bound for the same trusted application.

Memory corruption when allocating and accessing an entry in an SMEM partition.

Memory corruption while performing finish HMAC operation when context is freed by keymaster.

Transient DOS while loading the TA ELF file.

Memory corruption while processing key blob passed by the user.

Transient DOS while parsing a protected 802.11az Fine Time Measurement (FTM) frame.

Memory corruption while playing audio file having large-sized input buffer.

Memory corruption as GPU registers beyond the last protected range can be accessed through LPAC submissions.

Memory corruption when the IOCTL call is interrupted by a signal.