Qualcomm ≫ Qca6777aq Firmware

31 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.5

CVE-2025-21434

Transient DOS may occur while parsing EHT operation IE or EHT capability IE.

7.5

Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.

7.5

Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.

7.5

Transient DOS may occur while processing the country IE.

7.5

Information disclosure while parsing the OCI IE with invalid length.

9.8

Memory corruption during management frame processing due to mismatch in T2LM info element.

7.8

Memory corruption may occour occur when stopping the WLAN interface after processing a WMI command from the interface.

9.8

Memory corruption while parsing the ML IE due to invalid frame content.

7.5

Transient DOS can occur when the driver parses the per STA profile IE and tries to access the EXTN element ID without checking the IE length.

7.5

Transient DOS while parsing the ML IE when a beacon with common info length of the ML IE greater than the ML IE inside which this element is present.