Qualcomm ≫ Snapdragon 670 Mobile Firmware

27 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.5

CVE-2025-21454

Transient DOS while processing received beacon frame.

7.5

Transient DOS may occur while processing malformed length field in SSID IEs.

5.5

Transient DOS when importing a PKCS#8-encoded RSA private key with a zero-sized modulus.

7.8

Memory corruption while retrieving the CBOR data from TA.

8.2

Information disclosure while decoding this RTP packet Payload when UE receives the RTP packet from the network.

7.8

Cryptographic issue while processing crypto API calls, missing checks may lead to corrupted key usage or IV reuses.

7.8

Memory corruption while operating the mailbox in Automotive.

7.8

Memory corruption while processing a data structure, when an iterator is accessed after it has been removed, potential failures occur.

7.8

Memory corruption while triggering commands in the PlayReady Trusted application.

7.8

Memory corruption during memory mapping into protected VM address space due to incorrect API restrictions.