Qualcomm ≫ Snapdragon 660 Mobile Firmware

23 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2025-27061

Memory corruption whhile handling the subsystem failure memory during the parsing of video packets received from the video firmware.

7.8

Memory corruption while processing manipulated payload in video firmware.

7.8

Memory corruption while processing video packets received from video firmware.

7.5

Transient DOS while processing received beacon frame.

7.5

Transient DOS may occur while processing malformed length field in SSID IEs.

8.2

Information disclosure while decoding this RTP packet Payload when UE receives the RTP packet from the network.

7.8

Memory corruption while reading the FW response from the shared queue.

7.8

Memory corruption while processing a data structure, when an iterator is accessed after it has been removed, potential failures occur.

7.8

Warnung

Memory corruption while maintaining memory maps of HLOS memory.

7.8

Memory corruption when two threads try to map and unmap a single node simultaneously.