Qualcomm ≫ Snapdragon 8 Gen 3 Firmware

15 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2025-21424

Memory corruption while calling the NPU driver APIs concurrently.

5.5

Transient DOS can occur while processing UCI command.

7.5

Transient DOS may occur while processing the country IE.

7.8

Memory corruption may occur while validating ports and channels in Audio driver.

7.8

Memory corruption in display driver while detaching a device.

7.8

Memory corruption while handling multuple IOCTL calls from userspace for remote invocation.

7.8

Memory corruption may occur during the synchronization of the camera`s frame processing pipeline.

5.3

While processing the authentication message in UE, improper authentication may lead to information disclosure.

5.5

Information disclosure while deriving keys for a session for any Widevine use case.

6.5

Transient DOS during hypervisor virtual I/O operation in a virtual machine.