Qualcomm ≫ Snapdragon 8 Gen 2 Firmware

11 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2025-21424

Memory corruption while calling the NPU driver APIs concurrently.

7.5

Transient DOS may occur while processing the country IE.

7.8

Memory corruption may occur while validating ports and channels in Audio driver.

7.8

Memory corruption in display driver while detaching a device.

5.5

Information disclosure while deriving keys for a session for any Widevine use case.

6.5

Transient DOS during hypervisor virtual I/O operation in a virtual machine.

7.5

Transient DOS while parsing MBSSID during new IE generation in beacon/probe frame when IE length check is either missing or improper.

7.5

Transient DOS while processing TIM IE from beacon frame as there is no check for IE length.

7.8

Memory corruption while passing untrusted/corrupted pointers from DSP to EVA.

7.8

Memory corruption when Alternative Frequency offset value is set to 255.