Qualcomm ≫ Snapdragon 855 Mobile Platform Firmware

94 vulnerabilities found.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2023-33069

Memory corruption in Audio while processing the calibration data returned from ACDB loader.

7.8

Memory corruption in Audio while processing IIR config data from AFE calibration block.

7.8

Memory corruption in Audio while calling START command on host voice PCM multiple times for the same RX or TX tap points.

7.5

Transient DOS in Multi-Mode Call Processor due to UE failure because of heap leakage.

7.1

Information disclosure in Audio while accessing AVCS services from ADSP payload.

5.5

Transient DOS in Audio when invoking callback function of ASM driver.

7.5

Transient DOS in Multi-Mode Call Processor while processing UE policy container.

7.5

Transient DOS while parsing IPv6 extension header when WLAN firmware receives an IPv6 packet that contains `IPPROTO_NONE` as the next header.

7.8

Memory corruption in Audio when memory map command is executed consecutively in ADSP.

7.8

Memory corruption while running NPU, when NETWORK_UNLOAD and (NETWORK_UNLOAD or NETWORK_EXECUTE_V2) commands are submitted at the same time.