Qualcomm ≫ Snapdragon 730g Mobile Platform Firmware

45 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

8.8

CVE-2023-28585

Memory corruption while loading an ELF segment in TEE Kernel.

7.8

Memory corruption in UTILS when modem processes memory specific Diag commands having arbitrary address values as input arguments.

7.8

Memory Corruption in SPS Application while exporting public key in sorter TA.

7.8

Memory corruption in MPP performance while accessing DSM watermark using external memory address.

5.5

Information disclosure in WLAN HAL while handling command through WMI interfaces.

5.5

Information disclosure in WLAN HAL when reception status handler is called.

5.5

Information disclosure in WLAN HAL while handling the WMI state info command.

5.5

Information disclosure in IOE Firmware while handling WMI command.

7.8

Cryptographic issue in HLOS during key management.

7.8

Memory Corruption in Core due to secure memory access by user while loading modem image.