Qualcomm ≫ Snapdragon 710 Mobile Platform Firmware

Memory corruption can occur when arbitrary user-space app gains kernel level privilege to modify DDR memory by corrupting the GPU page table.

Transient DOS while parsing ESP IE from beacon/probe response frame.

Transient DOS while importing a PKCS#8-encoded RSA key with zero bytes modulus.

Memory corruption during session sign renewal request calls in HLOS.

Transient DOS while decoding attach reject message received by UE, when IEI is set to ESM_IEI.

Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released.

Memory corruption when allocating and accessing an entry in an SMEM partition.

Memory corruption while processing key blob passed by the user.

Memory corruption while performing finish HMAC operation when context is freed by keymaster.

Transient DOS while parse fils IE with length equal to 1.