Qualcomm ≫ Snapdragon Ar2 Gen 1 Firmware

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7.5

CVE-2024-33050

Transient DOS while parsing MBSSID during new IE generation in beacon/probe frame when IE length check is either missing or improper.

7.5

Transient DOS while parsing the received TID-to-link mapping element of beacon/probe response frame.

7.8

Memory corruption while passing untrusted/corrupted pointers from DSP to EVA.

7.8

Memory corruption when BTFM client sends new messages over Slimbus to ADSP.

7.5

Transient DOS while processing an improperly formatted Fine Time Measurement (FTM) management frame.

8.8

Memory corruption in Hypervisor when platform information mentioned is not aligned.

7.8

Memory corruption while copying a keyblob`s material when the key material`s size is not accurately checked.

7.8

Memory corruption in TZ Secure OS while Tunnel Invoke Manager initialization.

7.5

Information disclosure while handling T2LM Action Frame in WLAN Host.

7.8

Memory corruption when the IOCTL call is interrupted by a signal.