Qualcomm ≫ Snapdragon Xr1 Firmware

31 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.5

CVE-2025-21454

Transient DOS while processing received beacon frame.

7.5

Transient DOS may occur while processing malformed length field in SSID IEs.

5.5

Transient DOS when importing a PKCS#8-encoded RSA private key with a zero-sized modulus.

7.8

Memory corruption while retrieving the CBOR data from TA.

8.2

Information disclosure while decoding this RTP packet Payload when UE receives the RTP packet from the network.

7.8

Memory corruption while processing a data structure, when an iterator is accessed after it has been removed, potential failures occur.

7.8

Memory corruption while triggering commands in the PlayReady Trusted application.

7.8

Memory corruption while reading secure file.

7.5

Transient DOS may occur while processing the country IE.

5.5

Information disclosure while deriving keys for a session for any Widevine use case.