Qualcomm ≫ Snapdragon 425 Mobile Platform Firmware

31 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.5

CVE-2025-21428

Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request from the AP to establish a TSpec session.

7.8

Memory corruption while processing API calls to NPU with invalid input.

7.8

Memory corruption while processing GPU page table switch.

7.8

Memory corruption while processing voice packet with arbitrary data received from ADSP.

6.5

Transient DOS as modem reset occurs when an unexpected MAC RAR (with invalid PDU length) is seen at UE.

5.5

Transient DOS while handling PS event when Program Service name length offset value is set to 255.

8.2

Information disclosure while decoding Tracking Area Update Accept or Attach Accept message received from network.

7.5

Transient DOS when registration accept OTA is received with incorrect ciphering key data IE in Modem.

5.5

Transient DOS while importing a PKCS#8-encoded RSA key with zero bytes modulus.

7.5

Transient DOS while decoding attach reject message received by UE, when IEI is set to ESM_IEI.