Qualcomm ≫ Qcc2076 Firmware

104 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.5

CVE-2025-21448

Transient DOS may occur while parsing SSID in action frames.

7.8

Memory corruption when IOCTL call is invoked from user-space to write board data to WLAN driver.

7.8

Memory corruption when IOCTL call is invoked from user-space to write board data to WLAN driver.

7.5

Transient DOS may occur while parsing extended IE in beacon.

7.5

Transient DOS may occur while parsing EHT operation IE or EHT capability IE.

7.5

Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.

7.5

Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.

7.5

Transient DOS may occur while processing the country IE.

7.5

Information disclosure while parsing the OCI IE with invalid length.

9.8

Memory corruption during management frame processing due to mismatch in T2LM info element.