Qualcomm ≫ Qcc2076 Firmware

100 vulnerabilities found.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.5

CVE-2025-21434

Transient DOS may occur while parsing EHT operation IE or EHT capability IE.

7.5

Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.

7.5

Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.

7.5

Transient DOS may occur while processing the country IE.

7.8

Memory corruption while Invoking IOCTL calls from user-space to validate FIPS encryption or decryption functionality.

9.8

Memory corruption during management frame processing due to mismatch in T2LM info element.

7.5

Information disclosure while parsing the OCI IE with invalid length.

7.8

Memory corruption while handling IOCTL call from user-space to set latency level.

7.5

Transient DOS can occur when the driver parses the per STA profile IE and tries to access the EXTN element ID without checking the IE length.

7.8

Memory corruption while processing FIPS encryption or decryption validation functionality IOCTL call.