Qualcomm ≫ Snapdragon 845 Mobile Platform Firmware

82 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2023-33107

Warnung

Memory corruption in Graphics Linux while assigning shared virtual memory region during IOCTL call.

5.5

Transient DOS in Automotive OS due to improper authentication to the secure IO calls.

7.8

Memory corruption while using the UIM diag command to get the operators name.

7.8

Memory corruption in Boot while running a ListVars test in UEFI Menu during boot.

7.5

Transient DOS in Bluetooth Host while rfc slot allocation.

7.8

Memory corruption in BT controller while parsing debug commands with specific sub-opcodes at HCI interface level.

6.5

Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE.

8.8

Memory corruption while loading an ELF segment in TEE Kernel.

7.8

Memory corruption in UTILS when modem processes memory specific Diag commands having arbitrary address values as input arguments.

7.8

Memory Corruption in SPS Application while exporting public key in sorter TA.