Qualcomm ≫ Vision Intelligence 300 Platform Firmware

68 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

8.4

CVE-2024-21481

Memory corruption when preparing a shared memory notification for a memparcel in Resource Manager.

7.8

Memory corruption when allocating and accessing an entry in an SMEM partition.

7.8

Memory corruption when an invoke call and a TEE call are bound for the same trusted application.

7.8

Memory corruption while processing key blob passed by the user.

5.5

Transient DOS while loading the TA ELF file.

7.8

Memory corruption while performing finish HMAC operation when context is freed by keymaster.

7.5

Transient DOS while parse fils IE with length equal to 1.

7.5

Transient DOS in WLAN Firmware when the length of received beacon is less than length of ieee802.11 beacon frame.

7.8

Memory corruption in Core when updating rollback version for TA and OTA feature is enabled.

7.8

Memory corruption in Core while processing control functions.