Qualcomm ≫ Snapdragon 675 Mobile Platform Firmware

95 vulnerabilities found.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2024-23368

Memory corruption when allocating and accessing an entry in an SMEM partition.

7.8

Memory corruption when an invoke call and a TEE call are bound for the same trusted application.

5.5

Transient DOS while loading the TA ELF file.

7.8

Memory corruption while performing finish HMAC operation when context is freed by keymaster.

7.8

Memory corruption while processing key blob passed by the user.

7.5

Transient DOS while parse fils IE with length equal to 1.

7.5

Transient DOS in WLAN Firmware when the length of received beacon is less than length of ieee802.11 beacon frame.

7.5

Transient DOS while key unwrapping process, when the given encrypted key is empty or NULL.

9.8

Memory corruption in video while parsing the Videoinfo, when the size of atom is greater than the videoinfo size.

9.8

Memory corruption in video while parsing invalid mp2 clip.