Qualcomm ≫ Snapdragon Auto 4g Modem Firmware

105 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2023-33033

Memory corruption in Audio during playback with speaker protection.

7.5

Transient DOS while parsing WPA IES, when it is passed with length more than expected size.

7.8

Warnung

Memory corruption in Graphics Linux while assigning shared virtual memory region during IOCTL call.

7.8

Memory corruption when processing cmd parameters while parsing vdev.

7.5

Transient DOS when processing a NULL buffer while parsing WLAN vdev.

7.8

Warnung

Memory corruption in DSP Services during a remote call from HLOS to DSP.

5.5

Transient DOS in Automotive OS due to improper authentication to the secure IO calls.

7.5

Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame.

7.8

Memory corruption in Boot while running a ListVars test in UEFI Menu during boot.

7.8

Memory corruption while using the UIM diag command to get the operators name.