Qualcomm ≫ Snapdragon 630 Mobile Platform Firmware

47 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

7.8

CVE-2023-28549

Memory corruption in WLAN HAL while parsing Rx buffer in processing TLV payload.

7.8

Memory corruption in WLAN while sending transmit command from HLOS to UTF handlers.

7.8

Memory corruption in WLAN HAL while processing command parameters from untrusted WMI payload.

7.8

Memory corruption in WLAN handler while processing PhyID in Tx status handler.

7.8

Memory corruption in WLAN FW while processing command parameters from untrusted WMI payload.

7.8

Memory corruption in WLAN HAL while processing devIndex from untrusted WMI payload.

7.8

Memory corruption in WLAN HAL while processing WMI-UTF command or FTM TLV1 command.

7.5

Transient DOS due to improper authorization in Modem

7.8

Memory corruption due to double free in Core while mapping HLOS address to the list.

7.8

Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message.