Qualcomm ≫ Snapdragon 1200 Wearable Platform Firmware

Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.

Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request from the AP to establish a TSpec session.

Memory corruption when allocating and accessing an entry in an SMEM partition continuously.

Memory corruption while processing GPU page table switch.

Memory corruption while processing voice packet with arbitrary data received from ADSP.

Information disclosure while decoding Tracking Area Update Accept or Attach Accept message received from network.

Transient DOS while decoding attach reject message received by UE, when IEI is set to ESM_IEI.

Memory corruption in Audio while processing IIR config data from AFE calibration block.

Memory corruption in Audio while calling START command on host voice PCM multiple times for the same RX or TX tap points.

Memory corruption in Audio while processing the calibration data returned from ACDB loader.