Qualcomm ≫ Home Hub 100 Platform Firmware

23 Schwachstellen gefunden.

Hinweis: Diese Liste kann unvollständig sein. Daten werden ohne Gewähr im Ursprungsformat bereitgestellt.

6.5

CVE-2023-28586

Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE.

7.8

Memory Corruption in SPS Application while exporting public key in sorter TA.

5.5

Information disclosure in IOE Firmware while handling WMI command.

7.8

Memory Corruption in HLOS while importing a cryptographic key into KeyMaster Trusted Application.

7.8

Memory corruption in WLAN FW while processing command parameters from untrusted WMI payload.

7.8

Memory corruption in WLAN HAL while processing WMI-UTF command or FTM TLV1 command.

7.8

Memory corruption due to double free in Core while mapping HLOS address to the list.

5.5

information disclosure due to cryptographic issue in Core during RPMB read request.

7.8

Memory Corruption in Graphics while accessing a buffer allocated through the graphics pool.

7.8

Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target.